SHUWA Industry Co.,ltd
ABOUT US
SHUWA is a developer and manufacturer of semiconductor wafer polishing
and grinding equipment.(Si, SiC,GaN, InP, Ga2O3, AlN etc)
OUR PRODUCT
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Grinding System
High-precision grinding is possible using high-rigidity spindle technology that we have cultivated over many years.
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Lapping, Polishing,
CMP SystemWe have a lineup that pursues surface accuracy and flatness, from lapping to polishing to CMP.
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Mounter
De-MounterThe mounter attaches the wafer to the support substrate with precision, and the demounter peels off the wafer from the support substrate, even if the wafer is thinner than 100μm.
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Diamond Slurry
It has been used to lap ceramics, cemented carbide metals, etc. with high precision and efficiency. We can manufacture original diamond slurry according to customer requests.
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Consumables
We can offer consumables related to grinding and polishing, such as diamond slurry and diamond girinding wheel.
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Contract Grinding, Lapping, Polishing
We perform contract processing of grinding and polishing of various wafers using our own equipment.
