New type Vertical griding machine & Lapping machine

1) Vertical Gringing Machine <SGM-8000>
Grinding machine with maximum process - available 300mm diameter.
Shuwa's "the back-and-forward movement system" oriented for getting less damage to fragile materials. Full automatic grinding with automatic measurement system.

2) Single Surface Precision Lapping Machine <SW-300>
Surface plates will not get deviation of flatness ever. Operators are freed from check operation of plates. Everyone is able to get lapping work like masters are.

New type Bonding machines are under development

New items are under development at present;
Full-automatic bonding machine
Semi-automatic bonding machine