The lapping table of High-speed Precision Single-side Lapping Machine SW-07 rotates at up to 300 rpm. This machine adopted a high-speed rotation function, which realized a shorter processing period than conventional products, and an inverter speed-change system, which allows us to change the rotation speed smoothly to any speed. Moreover, this machine is equipped with the systems for upper spindle vibration/motion, fading, air cylinder compression, vacuum chuck, automatic change of rotation speed, cooling system, and so on.

High-Speed Rotation Function

The lapping table rotates at up to 300 rpm, realizing high-speed grinding. This machine shortened the processing time compared with the conventional machines of our company and improved the working efficiency.

Swing and Motion System of the Upper Spindle

Reciprocating motion and forced motion rotation enable you to grind a surface precisely to make a homogenous surface. In addition, the forced motion rotation system can set the upper spindle to any point on the lapping table.

Facing Mechanism

Facing mechanism is fitted as standard equipment and then the lapping table can be repaired readily and quickly.

Air Cylinder Pressing Mechanism

Thanks to the double air cylinder pressing mechanism, you can readily change the settings according to the type and size of work pieces.

Vacuum Chuck Mechanism

You can directly fix work pieces with the vacuum chuck, not using a carrier plate.

Device for Changing Rotation Speed

The adoption of an inverter speed-change system made it possible to smoothly change the rotation speed to any speed.

Device for Automatic Change of the Rotation Speed of the Lapping Table

You can freely change the rotation speed from low speed to high speed and vice versa with automatic system. You can also change the compression.

Cooling System

Heat would cause strain and considerably affect the precision. To avoid the heat generation, coolant is shot at the lower part of the lapping table.

ERotation Speed of Lapping Table

30`300rpm

EOutside Diameter of Lapping Table

380`400mm

ERotation Speed of Upper Spindle

30`230rpm

EVibration Speed of Upper Spindle

20 times/min

EVibration Amplitude of Upper Spindle

0`20min

ELoad on Upper Spindle

0`20kg

EMotor for Upper Spindle Rotation

Three-phase: 25 w

EMotor for Upper Spindle Vibration

Three-phase: 40 w

EMain Motor

Three-phase: 0.75 kw

EDimensions/Width, Depth, Height

900×800×1250mm

EWeight

400kg

¦Note that the contents of specifications and attachments are subject to change without notice.

Cloth Pad

Conditioner

Fluctuating Load Ring

Silica Slurry

Electroplating Diamond Plate Repair Ring

Ceramic Plate

Diamond Slurry

Bonding Machine

If you want the catalogue of these products or have any question, please feel free to contact us from here

Copyright(c) 2004 Shuwa Industry co.,ltd. All right reserved.
Produced by
Entrend.Inc.

 

 

Horizontal Surface Grinding Machine(SGM-S301)
High-speed Precision Single-side Lapping Machine(SW-07)

Bonding Machine (KBM-100 Series)
Render Diamond Polishing Liquid
Bonding Capillary

Name:Shuwa Industry Company,Ltd.
2-32-16 Takenotsuka, Adachi-ku, Tokyo 121-0813 Japan
TEL: +81-3-3883-6022FAX: +81-3-3883-6236