Vertical Grinding Machine type: SGM-8000 has been designed for the purpose of grinding high-brashness materials (Sappire, SiC, GaN, and so on) with high-preciseness in short time.
Such items as grinding stone and axes are settled paleways on single line. The axis, on the way of grinding, moves back and forward over the materials. The back and forward movement gives grinding to very thin thickness and less damages.
Maximum process-available 300mm diameter is able to make effective batch treatment and high productivity.

 Back & forward movement

The grinding stone grinds moving "back and forward" on the surface of the materials.
The stress to the materials goes at a rakish angle, not perpendicularly. Therefore the movement gives less deteriorations and very little thickness.

 Overload sensor system

Once the sensor acknowledges much overrode than that of set, the system gets the material plate back, releases overdue stress among wheel and material, and once start to grind.

 Intermittent Grinding System

Continuously grind and has interval time. Within the interval time sludge to be excluded, diamond wheel to be cool down, and the materials prevent overdue stress.

 Zero-Touch System

Zero-Touch System is the function to come in touch with starting point without human's divination.

 Oscillation movement

The SGM-8000 does oscillate its grind stone down and up when grinding process comes to the target value. The oscillate movement never goes over the target value. The movement makes higher flatness and less asperity.

 Automatic on going measuring System

Automatically measures the thickness of material, re-checks the thickness, and get final grinding. The operator needs no measuring and re-calculation of thickness until target thickness.

•Note that the contents of specifications and attachments are subject to change without notice.

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